光子设计与 PDKPhotonic Design & PDK
器件建模、线路仿真与版图设计流程,提供 PDK 支持。Device modeling, circuit simulation and layout flows, with PDK support.
设计 → 流片 → 封装 → 测试 → 系统,贯通产品开发每一个环节。Design → Fab → Packaging → Test → Systems — covering every step of product development.
器件建模、线路仿真与版图设计流程,提供 PDK 支持。Device modeling, circuit simulation and layout flows, with PDK support.
与晶圆制造工艺协同优化,支持多项目晶圆(MPW)与工程批。Co-optimization with wafer-fab processes, supporting MPW and engineering lots.
调制器、探测器、无源器件及多种激光集成路径。Modulators, detectors, passive components and multiple laser-integration approaches.
光纤耦合、光电共封装(CPO)与芯粒集成。Fiber coupling, co-packaged optics and chiplet integration.
晶圆级与器件级光电测试,以及面向产品化的验证流程。Wafer- and device-level electro-optical test and product-oriented validation flows.
从芯片到光模块、光引擎与系统的集成与调试。Integration and bring-up from chips to modules, engines and systems.
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