从核心器件到光引擎、光交换与传感系统，再到设计与封测服务。From core devices to optical engines, switching and sensing systems — plus design, packaging and test services.
面向数据中心与 AI 集群互连的硅光收发芯片及光模块方案，覆盖 400G / 800G / 1.6T 速率等级。Silicon photonic transceiver chips and optical module solutions for data-center and AI-cluster interconnect, covering 400G / 800G / 1.6T rate classes.
规格以官方资料为准Specs per official documentation
将光学引擎与交换/计算芯片共封装，缩短电通道，面向下一代高密度、低功耗网络架构。Optical engines co-packaged with switch / compute silicon to shorten electrical paths, targeting next-generation high-density, low-power network architectures.
规格以官方资料为准Specs per official documentation
以芯粒（Chiplet）形式提供光输入/输出能力，助力芯片间与板间的高带宽光互连。Optical input/output delivered as chiplets, enabling high-bandwidth optical links between chips and boards.
规格以官方资料为准Specs per official documentation
硅光核心器件与激光集成方案，包括调制器、光电探测器及多种激光器集成路径。Core silicon photonic devices and laser integration, including modulators, photodetectors and multiple laser-integration approaches.
规格以官方资料为准Specs per official documentation
基于硅光技术的光路交换芯片与系统，面向数据中心网络灵活重构的需求。Silicon-photonics-based optical circuit switching chips and systems for flexible reconfiguration of data-center networks.
规格以官方资料为准Specs per official documentation
面向激光雷达的硅光芯片方案，包括 FMCW 相干探测等技术方向。Silicon photonic chip solutions for LiDAR, including FMCW coherent detection and related directions.
规格以官方资料为准Specs per official documentation
利用集成光学结构实现生物分子与气体检测的光子传感芯片方案。Photonic sensing chips that use integrated optical structures for biomolecular and gas detection.
规格以官方资料为准Specs per official documentation
探索光子计算与面向 AI 算力的光互连架构，服务高带宽、低延迟计算场景。Exploring photonic computing and optical-interconnect architectures for AI compute, serving high-bandwidth, low-latency workloads.
规格以官方资料为准Specs per official documentation
提供硅光芯片的耦合、封装与测试服务，支持从样品到批量的工程化需求。Coupling, packaging and test services for silicon photonic chips, supporting engineering needs from samples to volume.
规格以官方资料为准Specs per official documentation
提供工艺设计套件（PDK）支持与定制化硅光芯片设计服务。Process design kit (PDK) support and custom silicon photonic chip design services.
规格以官方资料为准Specs per official documentation
说明：以上为产品方向的概括性介绍，具体型号、规格与性能参数以 SiPhTec 官方发布的产品资料为准。Note: the above are general descriptions of product directions. Specific models, specifications and performance figures are subject to official SiPhTec product documentation.
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